发明名称 |
CMOS type image sensor module having transparent polymeric encapsulation material |
摘要 |
A CMOS type of image sensor module for use in a mobile camera or a PC camera includes an image sensoring semiconductor chip encapsulated in a transparent block of polymeric material on a substrate having a circuit to which the ship is connected. The image sensoring semiconductor chip is disposed on an upper surface of the substrate as spaced vertically from a digital signal processing second semiconductor chip mounted on a lower surface of the substrate. The transparent polymeric encapsulation material constitutes a sealing resin unit. The digital signal processing second semiconductor chip may also be encapsulated by the sealing resin unit. The sealing transfer unit can be formed by injection and/or transfer molding. The forming of the sealing resin unit by a single molding process keeps production costs low.
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申请公布号 |
US7534645(B2) |
申请公布日期 |
2009.05.19 |
申请号 |
US20060494463 |
申请日期 |
2006.07.28 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOI KYOUNG-SEI |
分类号 |
H01L21/56;H01L27/14;H01L21/00;H01L21/50;H01L25/00;H01L27/146;H01L31/0203;H01L31/0232;H01L31/06;H04N5/225;H04N5/30 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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