发明名称 |
SEMICONDOCTOR DEVICE HAVING THROUGH-VIA AND METHOD OF FORMING THE SAME |
摘要 |
A semiconductor device includes a substrate, and a through electrode passing through the substrate. The semiconductor device has a pad region and a through electrode region. A pad covers the pad region, extends into the through electrode region, and delimits an opening in the through electrode region. A through electrode extends through the semiconductor substrate below the hole in the pad in the through region. |
申请公布号 |
KR20090049780(A) |
申请公布日期 |
2009.05.19 |
申请号 |
KR20070116070 |
申请日期 |
2007.11.14 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK, KI TAE;LEE, KANG WOOK;KIM, HYUN KYOUNG |
分类号 |
H01L23/12 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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