| 摘要 |
Systems and methods for positioning thermal sensors within an integrated circuit in a manner that provides useful thermal measurements corresponding to different parts of the integrated circuit. In one embodiment, an integrated circuit includes multiple, duplicate functional blocks. A separate thermal sensor is coupled to each of the duplicate functional blocks, preferably in the same relative location on each of the duplicate functional blocks, and preferably at a hotspot. One embodiment also includes thermal sensors on one or more functional blocks of other types in the integrated circuit. One embodiment includes a thermal sensor positioned at a cool spot, such as at the edge of the integrated circuit chip. Each of the thermal sensors may have ports to enable power and ground connections or data connections between the sensors and external components or devices.
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