首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
SYSTEM IN PACKAGE
摘要
申请公布号
KR20090049646(A)
申请公布日期
2009.05.19
申请号
KR20070115819
申请日期
2007.11.14
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
HAN, SEUNG WOO;KIM, DONG CHURL;LEE, YOUNG MIN;CHO, SHI YUN
分类号
H01L23/48;H01L21/60;H01L23/12
主分类号
H01L23/48
代理机构
代理人
主权项
地址
您可能感兴趣的专利
BANKBOOK FEED CONTROL SYSTEM
SUPPORT DEVICE FOR ROTARY TOOL
DISTRIBUTED FEEDBACK SEMICONDUCTOR LASER DEVICE
SOLID STATE IMAGE PICKUP ELEMENT
MANUFACTURE OF SEMICONDUCTOR DEVICE
INTERNAL EDGE BLADE CLAMPING FRAME
PACKAGE STRUCTURE FOR ELECTRONIC COMPONENT
COMPOSITE CERAMIC MULTILAYER WIRING SUBSTRATE AND MANUFACTURE OF THE SAME
AQUEOUS ZEOLITE SUSPENSION
PRODUCTION OF COENZYME A
PRODUCTION OF USEFUL SUBSTANCE BY CELL CULTIVATION
HEAT TREATMENT OF GAAS SINGLE CRYSTAL
VAPOR PHASE CRYSTAL GROWING DEVICE
METHOD AND APPARATUS FOR CENTRIFUGAL TYPE CHEMICAL ANALYSIS
RECORDER
METHOD AND APPARATUS FOR MEASURING ENZYMATIC ACTIVITY
POLYESTER COMPOSITION
POLYVINYLIDENE FLUORIDE COMPOSITION
MOLD FOR INJECTION MOLDING
SHEET CONVEYING DEVICE