| 摘要 |
In a method and system for fabricating a full wafer (600) having dies, an orientation marker (606), and a reference die (608), includes configuring a reticle pattern (602) that is configured by arranging the dies in an array having m rows and n columns, where the m rows start in a row adjacent to the orientation marker (606), and m and n are integers. The reticle pattern (602) is transferred to the full wafer (600) to sequentially form a portion of the dies. The transferring includes placing an inkless marker (620) in the form of one or more non-circuit dies between the n columns of adjacent reticle patterns. The reticle pattern (602) is repeatedly transferred to form a remaining portion of the dies to complete the full wafer (600). A wafer map for the full wafer (600) is stored, with the wafer map including a non-circuit bin containing data describing the inkless marker (620).
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