SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME AND OPERATION METHOD OF THE SAME

摘要

Described are a semiconductor device, methods of forming the semiconductor device and methods of operating the semiconductor device. The semiconductor device includes a gate electrode and laminated charge trap layers interposed between substrates. The methods of forming the semiconductor device include forming a gate stacked structure including insulating layers having a different etching selectivity, forming spaces on sidewalls of the gate stacked structure using an etching selectivity and forming charge trap layers in the spaces. The methods of operating the semiconductor device include programming trap layers by controlling a voltage applied to a gate electrode.