发明名称 Solid-state imaging device, camera module and electronic equipment module
摘要 To provide a back-illuminated type solid-state imaging device capable of color separation of pixels without using a color filter, and a camera module and an electronic equipment module which incorporate the solid-state imaging device. A solid-state imaging device including: a photoelectric conversion element PD formed in a semiconductor substrate 22; a reading-out part which reads out signal charges from the photoelectric conversion element PD formed on one surface side of the semiconductor substrate 22; the other surface of the semiconductor substrate 22 made to a light incidence surface; and a pixel which exclusively makes light of a specific wavelength or longer photoelectrically converted, by adjusting pn junction depths h2 [h2 r, h2 g, h2 b] between the photoelectric conversion element PD and an accumulation layer 28 on the light incidence surface side. A camera module and an electronic equipment module which incorporate the solid-state imaging device.
申请公布号 US7535073(B2) 申请公布日期 2009.05.19
申请号 US20050208960 申请日期 2005.08.22
申请人 SONY CORPORATION 发明人 EZAKI TAKAYUKI
分类号 H01L31/00;H01L27/146;H01L31/0232;H01L31/06;H04N5/335;H04N5/369;H04N5/374 主分类号 H01L31/00
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