发明名称 |
LEISTUNGSHALBLEITERMODUL MIT KONTAKTFEDERN |
摘要 |
The module (1) has conductor strips (20) arranged at a main axis of a substrate (2), and a semiconductor component (3) arranged at one of the conductor strips with main surface. Connection units start from the conductor strips or contact surfaces (30) at another main surface of the component for forming contact springs (5). Each contact spring with two contact sections (52, 54) is formed as a laminar molded body, where each contact section has a convex curve orthogonal to its depression center. |
申请公布号 |
AT430987(T) |
申请公布日期 |
2009.05.15 |
申请号 |
AT20080000990T |
申请日期 |
2008.01.19 |
申请人 |
SEMIKRON ELEKTRONIK GMBH & CO. KG |
发明人 |
LEDERER, MARCO;POPP, RAINER |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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