发明名称 |
CAMERA MODULE AND ELECTRONIC APPARATUS INCLUDING THE SAME |
摘要 |
<p>A camera module includes an image sensor chip, a lens structure, a transparent substrate, an adhesive portion, and a light blocking layer. The image sensor chip includes a light receiving area and a circuit area. The lens structure is positioned on the image sensor chip and configured to allow light to enter the image sensor chip. The transparent substrate is positioned between the image sensor chip and the lens structure, the transparent substrate allowing light from the lens structure to enter the light receiving area. The adhesive portion attaches the image sensor chip and the transparent substrate, and covers the circuit area. The light blocking layer is attached to the transparent substrate to block light from entering the circuit area.</p> |
申请公布号 |
KR20090048920(A) |
申请公布日期 |
2009.05.15 |
申请号 |
KR20070115032 |
申请日期 |
2007.11.12 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KWON, YONG HWAN;KANG, UN BYOUNG;LEE, CHUNG SUN;KWON, WOON SEONG;JANG, HYUNG SUN |
分类号 |
H04N5/225;G03B17/00;H01L27/146 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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