发明名称 LEAD FRAME STRUCTURE AND APPLICATIONS THEREOF
摘要 A lead frame structure comprises a side rail, a first paddle, a second paddle, a plurality of leads, and an downset anchor bar. The first paddle is connected to the side rail via at least one first tie bar, and the second paddle is connected to the side rail via at least one-second tie bar. The first paddle and the second paddle separated from each other are used to define an area to support a chip. These leads set on the side rail expends toward to the chip supporting area. One end of the downset anchor bar is connected to the side rail, and the other end of the downset anchor bar has a protrusion portion which is between the first paddle and the second paddle and is downset from the side rail.
申请公布号 KR20090049012(A) 申请公布日期 2009.05.15
申请号 KR20080073956 申请日期 2008.07.29
申请人 ORIENT SEMICONDUCTOR ELECTRONICS LIMITED 发明人 CHEN CHIA YU;PONG TA LIN;CHANG EN SHOU;CHENG I CHI;SU CHEN PING
分类号 H01L23/495 主分类号 H01L23/495
代理机构 代理人
主权项
地址