| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component with bumps manufacturable by a simple manufacturing method not causing a soldering failure even if a thin spot is formed on cream solder print on a board, nor particularly requiring a complicated manufacturing method, and allowing each conductive junction part to be formed into a hand drum-like shape when solder is reflowed and connected to the board, and also to provide an electronic component mounting body, and a mounting method of an electronic component. <P>SOLUTION: This electronic component with bumps includes nearly-conical bumps 12 each formed of a solid conductive material. In this mounting method of the electronic component, solder is stuck to a board to provide the bumps each formed into a nearly-conical shape from the solid conductive material and having the same height, and each junction part between the electronic component with bumps and the board is formed into a hand drum-like shape. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
