| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a mounting structure of an electronic component that improves the reliability of connection between a bump electrode and a terminal, and to provide a manufacturing method for such a mounting structure of an electronic component. <P>SOLUTION: A bump electrode 21 has a resin core 22 and a conductive film 23 provided on the top surface of the resin core 22, wherein the conductive film 23 comes in conductive contact with a terminal 17 through elastic deformation of the resin core 22. Around the bump electrode 21, an adhesion layer 31 is arranged for keeping a conductive contact state between the terminal 17 and the conductive film 23. The adhesion layer 31 is formed by liquefaction followed by hardening of a resin material with a storage elasticity modulus which becomes smaller than that of the resin core 22 by heating up to a given temperature and a decreasing amount of the storage elasticity modulus which becomes greater than that of the resin core 22. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
