发明名称 |
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device including a FIN-type transistor excellent in characteristics by accurately forming a FIN-shaped semiconductor and a gate electrode or by reducing fluctuation in characteristics among elements. <P>SOLUTION: The semiconductor device includes the FIN-shaped semiconductor 10 having a source region at one side and a drain region at the other side, and a gate electrode 17 formed to surround the FIN-shaped semiconductor 10 via a gate insulation film between the source and drain regions. As one of solutions of the invention, a metal material or a silicide material capable of wet etching is used in the gate electrode 17. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009105122(A) |
申请公布日期 |
2009.05.14 |
申请号 |
JP20070273679 |
申请日期 |
2007.10.22 |
申请人 |
RENESAS TECHNOLOGY CORP |
发明人 |
IWAMATSU TOSHIAKI;TERADA TAKASHI;SHINOHARA HIROBUMI;ISHIKAWA KOZO;TSUCHIYA RYUTA;HAYASHI KIYOSHI |
分类号 |
H01L29/786;H01L21/265;H01L21/336;H01L21/8234;H01L21/8238;H01L27/08;H01L27/088;H01L27/092;H01L29/423;H01L29/49;H01L29/78 |
主分类号 |
H01L29/786 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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