发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device including a FIN-type transistor excellent in characteristics by accurately forming a FIN-shaped semiconductor and a gate electrode or by reducing fluctuation in characteristics among elements. <P>SOLUTION: The semiconductor device includes the FIN-shaped semiconductor 10 having a source region at one side and a drain region at the other side, and a gate electrode 17 formed to surround the FIN-shaped semiconductor 10 via a gate insulation film between the source and drain regions. As one of solutions of the invention, a metal material or a silicide material capable of wet etching is used in the gate electrode 17. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009105122(A) 申请公布日期 2009.05.14
申请号 JP20070273679 申请日期 2007.10.22
申请人 RENESAS TECHNOLOGY CORP 发明人 IWAMATSU TOSHIAKI;TERADA TAKASHI;SHINOHARA HIROBUMI;ISHIKAWA KOZO;TSUCHIYA RYUTA;HAYASHI KIYOSHI
分类号 H01L29/786;H01L21/265;H01L21/336;H01L21/8234;H01L21/8238;H01L27/08;H01L27/088;H01L27/092;H01L29/423;H01L29/49;H01L29/78 主分类号 H01L29/786
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