| 摘要 |
<p>A phosphorus-containing phenol compound represented by the general formula (2) in which the content of a compound represented by the general formula (1) is 2.5 wt.% or lower is used to obtain a phosphorus-containing epoxy resin having high curability. This highly reactive phosphorus-containing epoxy resin and a phosphorus-containing epoxy resin composition containing the resin are suitable for use in applications such as a sealing material, molding material, potting material, adhesive, material for electrical insulating coatings, electrical insulating sheet, resin-coated copper foil, prepreg, electrical laminate, etc. for use in producing copper-clad laminates for electronic circuit boards and in producing electronic parts. Also provided are: a curable resin composition containing either of the resin and the resin composition; and a cured object obtained from either of the resin and the resin composition. General formula (1) (1) Symbol n is 0 or 1. R1 and R2 each represents hydrogen or a hydrocarbon group, may be the same or different, and may be linear, branched, or cyclic. R1 and R2 may be bonded to each other to form a cyclic structure. B represents any of benzene, biphenyl, naphthalene, anthrancene, phenanthrene, and substituted forms of these hydrocarbons. General formula (2) (2) Symbol n is 0 or 1. R1 and R2 each represents hydrogen or a hydrocarbon group, may be the same or different, and may be linear, branched, or cyclic. R1 and R2 may be bonded to each other to form a cyclic structure. B represents any of benzene, biphenyl, naphthalene, anthrancene, phenanthrene, and substituted forms of these hydrocarbons.</p> |
