| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board with a built-in component efficiently manufactured by a simple process; and to provide a method of manufacturing the same. <P>SOLUTION: In manufacturing the printed wiring board 21 with the built-in component which is composed by stacking a plurality of wiring layers including a core layer 1, and having an electronic component 7 with solder bumps mounted on the core layer 1, solder parts 6* formed by melting and solidifying the solder bumps 6 on the core layer 1 are restrained from expanding to the outside of the ranges of electrodes 3a by solder resists 4 of which the formation range is limited to an undersurface part of the electronic component 7, and spaces between the electronic component 7 and them are sealed by sealing resin parts 9. Thereby, the solder parts 6* can be protected in a blackening process executed for securing adhesiveness of prepreg in stacking the plurality of wiring layers, and the printed wiring board with a built-in component can be efficiently manufactured by a simple process of mounting the component on the core layer and stacking the wiring layers by using the prepreg. <P>COPYRIGHT: (C)2009,JPO&INPIT |
