| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a power semiconductor module in which a plurality of power semiconductor elements are connected to form a module, and which reduces and equalizes parasitic inductance of wiring without limitation of arrangement and the number of the power semiconductor elements. <P>SOLUTION: The power semiconductor module includes patterns on a substrate, which are a first electrode pattern and a second electrode pattern connected to two electrode as a first electrode and a second electrode of the power semiconductor element, a first electrode wiring conductor wired between the first electrode pattern and an external connection terminal, and a second electrode wiring conductor wired between the second electrode pattern and the external connection terminal. The second electrode wiring conductor is connected at a point of the second electrode pattern closer to one direction in an axial direction from an intermediate point of alignment of a connection part where a lead from the second electrode is connected, and the second electrode wiring conductor includes a second electrode arm extending in approximately parallel to an axis, and a length of a parallel part to the axis of the second electrode arm has more than a half of a length of alignment with the power semiconductor elements arranged. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
