发明名称 METHOD OF MANUFACTURING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component having high reliability, in which disconnection or the like in a coil or internal electrodes inside the electronic component hardly occurs. SOLUTION: The method of manufacturing the electronic component includes: arranging a coil wiring 77 or internal electrodes inside a protection part 17 made of resin; and arranging external electrodes at both ends and both end surfaces of the protection part 17, thereby forming a plurality of the electronic components 42. An end surface of an external electrode 23 of a first electronic component 22 is brought into contact with a side surface of the protection part 26 of a neighboring second electronic component 25; an end side surface of the external electrode 23 of the first electronic component 22 is brought into contact with an almost square dummy protection part 28; and the first electronic component 22, the second electronic component 25, a third electronic component 30, and a fourth electronic component 31 are formed by continuously arranging them in a swirling manner. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009105418(A) 申请公布日期 2009.05.14
申请号 JP20080309386 申请日期 2008.12.04
申请人 PANASONIC CORP 发明人 MORIMOTO SHINICHI;TAOKA MIKIO;NAKAYAMA HIDEAKI;NISHIMURA SEIICHI
分类号 H01F41/04;H01G13/00 主分类号 H01F41/04
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