发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device executing stable device separation by using selective epitaxial growth. SOLUTION: In the method of manufacturing the semiconductor device manufactured by stacking a semiconductor layer on a semiconductor substrate, when the semiconductor devices on the semiconductor substrate are separated, device units to be separated are enclosed by an insulation film, and the semiconductor device is formed by stacking the semiconductor layer in the enclosure. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009105105(A) 申请公布日期 2009.05.14
申请号 JP20070273287 申请日期 2007.10.22
申请人 YOKOGAWA ELECTRIC CORP 发明人 ARAKI SHOJIRO
分类号 H01L21/762;H01L21/20;H01L21/76;H01L31/10 主分类号 H01L21/762
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