| 发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE INTEGRATION |
| 摘要 |
An integrated circuit package system comprising: providing a substrate having a cavity; sealing a package over the cavity of the substrate; and forming an encapsulant over the package and a portion of the substrate substantially preventing the encapsulant from forming in the cavity.
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| 申请公布号 |
US2009121335(A1) |
申请公布日期 |
2009.05.14 |
| 申请号 |
US20070938371 |
申请日期 |
2007.11.12 |
| 申请人 |
|
发明人 |
CAMACHO ZIGMUND RAMIREZ;PISIGAN JAIRUS LEGASPI;ADVINCULA ABELARDO JR.;TAY LIONEL CHIEN HUI |
| 分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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