| 摘要 |
A method and apparatus for a backside metallization of a wafer is provided. The wafer comprised of a first substance is bent by creating tension on a backside and creating compression on a front side prior to deposition of a thin film of a second substance. After deposition, the wafer is released and the thin film deposited on the wafer exhibits less tensile stress than if the thin film was deposited on a flat wafer.
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