| 摘要 |
<p>Electronic component comprising at least one chip and/or one support, the chip being intended to be transferred onto the support and linked, at the level of at least one connection site (102) of the chip, formed by at least one portion (108) of a layer (104) of the chip, to at least one connection site of the support formed by at least one portion of a layer of the support, by at least one ball, the chip and/or the support comprising means for mechanical decoupling of the connection site (102) of the chip and/or of the support with respect to the chip and/or to the support, which means are formed by at least one cavity (110) made in the layer of the chip and/or of the support, under the connection site of the chip and/or of the support, and at least one trench (114), made in the layer of the chip and/or of the support, communicating with said cavity.</p> |
