发明名称 NETHOD OF MANUFACTURING METHOD OF PIEZOELECTRIC BODY FILM, AND PIEZOELECTRIC ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a piezoelectric body film containing no lead, high in the Curie temperature, and having an excellent piezoelectric characteristic, and also to provide a piezoelectric element. <P>SOLUTION: This method of manufacturing a piezoelectric body film includes processes of: preparing a sol-like precursor solution containing Bi, Ti, Ba, Sr and Nd; preparing particles each formed of a substance represented by a general formula: Bi<SB>4-x</SB>Nd<SB>x</SB>Ti<SB>3</SB>O<SB>12</SB>-(Ba<SB>1-y</SB>Sr<SB>y</SB>)Bi<SB>4</SB>Ti<SB>4</SB>O<SB>15</SB>, wherein x is a number of 0.1-1.5, and y is a number of 0.2-0.8; preparing paste containing the particles; preparing mixture paste by mixing the paste with the sol-like precursor solution; and applying the mixture paste and thereafter drying and baking it. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009105176(A) 申请公布日期 2009.05.14
申请号 JP20070274652 申请日期 2007.10.23
申请人 SEIKO EPSON CORP 发明人 O SHOKO
分类号 H01L41/09;C04B35/46;C04B35/462;H01L41/187;H01L41/22;H01L41/314;H01L41/318;H01L41/39;H01L41/43;H03H9/17 主分类号 H01L41/09
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