| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring substrate with a built-in plate-like component which is superior in reliability, by appropriately interposing resin filler in a clearance between a housing hole and the plate-like component. <P>SOLUTION: A wiring substrate 10 with a built-in ceramic capacitor comprises a core substrate 11, a ceramic capacitor 101 which is housed in a housing hole 91 formed in the core substrate 11, and build up layers 31 and 32, formed on the upper and lower surfaces of the core substrate 11 and the ceramic capacitor 101. In the wiring substrate 10 with the built-in ceramic capacitor, the ceramic capacitor 101 is fixed to the core substrate 11, by filling a clearance between the upper surface of the housing hole 91 and the side surface of the ceramic capacitor 101 with resin filler 92. The cross-sectional shape of the housing hole 91 gradually becomes wider, as going toward a core rear surface 13 side, from a core principal surface 12 side. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
