| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper foil with a resin for a multilayer printed wiring board easily moldable and well-balanced in all properties including metal foil adhesion, heat resistance, humidity resistance, flame retardance, metal-adhering heat resistance, specific inductive capacity, and dielectric loss tangent; and to provide a high performance and high density multilayer printed wiring board prepared using the same. SOLUTION: The copper foil with the resin for a multilayer printed wiring board is provided by applying to one surface of a copper foil, being followed with a stage B conversion process: a thermosetting resin composition in the form of a homogeneous solution containing a 6-substituted guanamine compound (a), a phenolic compound (b), an epoxy resin (c) having at least two epoxy groups in one molecule and an organic solvent (d); or a thermosetting resin composition in the form of a homogeneous solution obtained by adding a maleimide compound (e) having at least two N-substituted maleimide groups in one molecule to the above thermosetting resin and making the maleimide compound (e) react with the 6-substituted guanamine compound (a). A multilayer printed wiring board manufactured using the same is also provided. COPYRIGHT: (C)2009,JPO&INPIT |
