| 摘要 |
PROBLEM TO BE SOLVED: To contribute to the improvement of the EMI performance of a multi-layer wiring substrate, without generating the problem of crosstalks, by actively suppressing the generation of magnetic fields due to signal transmission. SOLUTION: In the pattern-layout structure of the multi-layer substrate, signal-line patterns 11-13 are disposed alternately between layers and guard patterns 21-23, having grounding potentials are disposed on the surfaces opposite to the respective signal-line patterns 11-13. Also, the space between the signal-line pattern 13 and the guard pattern 22 adjacent thereto may be narrowed more than the width of each guard pattern. COPYRIGHT: (C)2009,JPO&INPIT |
