| 摘要 |
An interconnecting structure for interconnecting two electronic modules. The structure includes a dielectric substrate having a copper trace deposited on the lower surface thereof, and a copper pad disposed on the upper surface of the substrate directly above one end of the trace. A first copper plate-up area deposited on the pad, and a second copper plate-up area is deposited on the distal end of the trace. A slot, semi-circumscribing the pad and extending on both sides of the trace toward the distal end of the trace, is cut through the substrate to allow the proximal end of the trace to be displaced in a cantilevered manner below the lower side of the substrate when a force is applied to the pad.
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