| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is excellent in flowability, adhesion and elastic modulus reducing effect and gives a cured material, and to provide an electronic component device with elements sealed with the composition. SOLUTION: The epoxy resin composition includes an epoxy resin (A), a curing agent (B) and a silicone compound (C), wherein the silicone compound (C) is a compound represented by a specific chemical formula (I-1) and (I-2). COPYRIGHT: (C)2009,JPO&INPIT
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