Elektronisches Bauteil mit einem Stapel aus Halbleiterchips und Verfahren zur Herstellung desselben

摘要

Electronic component comprises a stack of semiconductor chips (2, 3) of different size. The first semiconductor chip (2) has a lower thickness (d) and lower outer dimensions than the second semiconductor chip (3). The second semiconductor chip has a recess (5) on its passive rear side (4) in which the first semiconductor chip is arranged. An Independent claim is also included for a process for the production of the electronic component.