| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a compact electronic device by uniting a functional structure disposed in a cavity on a substrate and an electronic circuit in one body at high level, and to manufacture the functional structure disposed in the cavity on the substrate concurrently to the electronic circuit to reduce manufacturing cost thereof. <P>SOLUTION: The invention relates to an electronic device including the substrate 1, a functional structure 3X constituting a functional element formed on the substrate, and a coating structure defining the cavity portion S where the functional structure is disposed, wherein the coating structure includes a stack structure of interlayer insulating films 4 and 6 and wiring layers 5 and 7 formed on the substrate to enclose a circumference of the cavity portion, and an upper coating portion 7Y of the coating structure which covers the cavity portion from above is composed of portions of the wiring layers disposed above the functional structure. <P>COPYRIGHT: (C)2009,JPO&INPIT |
