| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting apparatus capable of effecting delamination of a sheet adhered to an anisotropic conductive member without damaging a substrate when pressure-bonding a TCP to the substrate. SOLUTION: The mounting apparatus comprises a pressure bonding tool 15 for mounting the TCP under heat and pressure, the TCP being attached to a side section of a substrate, the substrate being held by a backup tool (14) at its bottom surface when it is driven in a downward direction by a Z-direction table driving source (7) of conveying means 2 which drives the substrate upward and downward directions; a cassette 25 which is driven by a cassette Z-direction driving source 23 in upward and downward directions, the cassette having the sheet to be interposed between a top surface of the side of the substrate and the pressure bonding tool when mounting the TCP by the pressure bonding tool; and a controlling apparatus which, after ascending the pressure bonding tool after the TCP is mounted on the substrate by the pressure bonding tool, ascends the cassette, and at the same time, ascends the substrate at a lower rate than the cassette to effect delamination of the sheet adhered to a portion of an anisotropic conductive member of the TCP which is exposed from the TCP upon mounting of the TCP. COPYRIGHT: (C)2009,JPO&INPIT
|
