发明名称 |
HEATING AND PRESSURIZING APPARATUS FOR USE IN MOUNTING ELECTRONIC COMPONENTS, AND APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS |
摘要 |
A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.
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申请公布号 |
US2009120998(A1) |
申请公布日期 |
2009.05.14 |
申请号 |
US20090350334 |
申请日期 |
2009.01.08 |
申请人 |
MINAMITANI SHOZO;HOSOTANI NAOTO;MORITA KOICHI;ONOBORI SYUNJI;NISHINO KENICHI |
发明人 |
MINAMITANI SHOZO;HOSOTANI NAOTO;MORITA KOICHI;ONOBORI SYUNJI;NISHINO KENICHI |
分类号 |
B23K31/02;H01L21/00;H01L21/56 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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