| 摘要 |
Provided are a cover tape and an electronic component packaging system using the cover tape. According to example embodiments, a cover tape may include a core cover part configured to cover a core upper part of a structure with a serial insertion of a plurality of parts, a periphery junction part on both sides of the core cover part configured to adhere to an upper periphery of the structure, and a cut part between the core cover part and the periphery junction part configured to lie over the upper periphery of the structure.
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