| 摘要 |
A device comprising a component and an adhesive attached to at least one exterior portion of the component. When the component is on a printed circuit and passed through a reflow operation, the adhesive melts forming a physical bond between the component and the printed circuit. The printed circuit may be a flexible printed circuit or a printed circuit board. The adhesive may melt under and to at least one edge of the component. The adhesive may also melt under and to at least one edge of the component and under and to at least one edge of at least one second component adjacent to the component.
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