FPCB SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

摘要

A flexible printed circuit board substrate includes an electrically conductive layer, an insulation layer, and a hook. The electrically conductive layer has a first surface and a second surface at an opposite side thereof to the first surface. The insulation layer having a third surface and a fourth surface at an opposite side thereof to the third surface. The third surface of the insulation layer combines with the second surface of the electrically conductive layer. A through hole is defined in the electrically conductive layer and the insulation layer extending from the first surface of the electrically conductive layer to the fourth surface of the insulation layer. The hook extends from the electrically conductive layer and passes through the through hole to protrude from the fourth surface of the insulation layer.