| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive sheet for processing a fragile member capable of stably holding the fragile member when conveying the fragile member such as a semiconductor wafer and applying a processing such as rear surface grinding to the fragile member, and desirably used for a method of treating the fragile member by which, after a predetermined treatment is completed, the fragile member can be peeled off without being damaged. <P>SOLUTION: This adhesive sheet for processing a fragile member comprises a laminated film base 10 which has a first film 11 and a second film 12 and which is formed by joining the peripheral edge parts thereof to each other and adhesive agent layers 11a, 12a formed on both outer surfaces of the laminated film base 10, respectively. <P>COPYRIGHT: (C)2009,JPO&INPIT |
