发明名称 Clad Contact Point Material and Method for Mounting a Clad Contact Point Material
摘要 A clad contact point material 1 is formed into a tape in shape by attaching by pressure a contact point part 3 of silver or silver nickel to a copper base material 2, silver plating 4 is performed on the entire material. A 2 mm clad contact point 6 segmented from the clad contact point material 1 is pushed into a lower hole 8 provided at the end part of a 0.15 mm thick beryllium copper movable plate 7 caulked as shown in FIG. 2D, and mounted as a contact point. Since the caulked part includes more silver plated part at the ratio of 1:1.3, it is antioxidant and anticorrosive under a high temperature condition, thereby increasing a service life of the contact point, and realizing uses under higher temperature and larger current conditions.
申请公布号 US2009120666(A1) 申请公布日期 2009.05.14
申请号 US20070225511 申请日期 2007.03.08
申请人 TAKEDA HIDEAKI 发明人 TAKEDA HIDEAKI
分类号 H01B5/00;H05K3/00 主分类号 H01B5/00
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