| 发明名称 |
METHOD OF FABRICATING AN EXPOSED DIE PACKAGE |
| 摘要 |
A method of fabricating an exposed die package. A feature on at least one side of the die is formed. The die is placed on a substrate and encapsulated. Then, the die is removed from the substrate to reveal an exposed die surface. |
| 申请公布号 |
WO2007058781(A3) |
申请公布日期 |
2009.05.14 |
| 申请号 |
WO2006US42763 |
申请日期 |
2006.11.01 |
| 申请人 |
ANALOG DEVICES, INC.;GOIDA, THOMAS, M. |
发明人 |
GOIDA, THOMAS, M. |
| 分类号 |
H01L21/20 |
主分类号 |
H01L21/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
