| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder-mounted printed circuit board capable of improving solder wicking performance by suppressing heat dissipation to a solid pattern. SOLUTION: In the printed circuit board in which a through-hole 2 is formed on the solid pattern 1, and a land 3 is formed at the periphery of the through-hole, a thermal land 4 is formed at a part of the outer circumference of the land 3, at least one through-hole 5 is formed at the outer circumference of the thermal land 4, and resist 6 is applied to the outer circumference of the thermal land including the peripheral edge of the through-hole. COPYRIGHT: (C)2009,JPO&INPIT
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