| 发明名称 |
Wafer and a Method of Dicing a Wafer |
| 摘要 |
A wafer includes a plurality of chips, each of the chips being spaced from each other by kerf-line regions including a reduced width. |
| 申请公布号 |
US2009121321(A1) |
申请公布日期 |
2009.05.14 |
| 申请号 |
US20070938585 |
申请日期 |
2007.11.12 |
| 申请人 |
|
发明人 |
MICCOLI GIUSEPPE;JAYACHANDRAN BHASKARAN;STEFFEN FRIEDRICH;VATER ALFRED |
| 分类号 |
H01L21/78;H01L23/58;H01L27/118 |
主分类号 |
H01L21/78 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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