| 摘要 |
The present invention provides a conductive metal paste, available for fabrication of a metal fine particle sintered product layer, which has excellent adhesion to a surface of an underlying substrate such as a glass substrate and also has good conductivity. The conductive metal paste according to the present invention contains, per 100 parts by mass of the metal fine particles whose average particle size is 1 to 100 nm, 10 to 60 parts by mass in total of one or more compounds which are used in a coating molecular layer on a surface of a metal fine particle and which have a group capable of coordinate bonding to a metal element contained in the metal fine particles via a lone pair held by a nitrogen, oxygen, or sulfur atom, and also contains one or more metal compounds which are reduced by heating up to 250°C or higher to be able to precipitate a metal atom such that a total amount of metals contained in the metal compound is within a range from 0.3 to 7 parts by mass, and further, 100 to 500 parts by mass of an amine-based solvent capable of dissolving the metal compounds blended per 10 parts by mass in total of metals in the metal compounds, wherein all of these components are uniformly dissolved and dispersed in an organic solvent used as a dispersion solvent for the metal fine particles. |
