| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of separating a predetermined three-dimensional structure that is not degraded or is slightly degraded from a sample, and a device for executing this method. <P>SOLUTION: This method for a three-dimensional microdissection is used for separating the predetermined structure from the sample in a sub millimeter region by cold laser ablation or multi-photon absorption. In this method for a three-dimensional micro die section, release of the structure to be separated is performed by directional information in all space directions. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
