| 摘要 |
The microelectronic imager packages include a semiconductor die having a plurality of photo sensors, a cover spaced apart from the semiconductor die and facing the photo sensors, and a coupling structure between the semiconductor die and the cover. The coupling structure has a spacer separating the semiconductor die and the cover and an adhesive proximate to the spacer. The adhesive bonds the spacer, the semiconductor die, and the cover together.
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