发明名称 GOLD ALLOY WIRE FOR BALL BONDING
摘要 A gold alloy wire for use in ball bonding which comprises 15-50 mass ppm magnesium (Mg), 10-30 mass ppm calcium (Ca), 5-20 mass ppm europium (Eu), 5-20 mass ppm yttrium (Y), 5-20 mass ppm lanthanum (La), and gold (Au) having a purity of 99.998 mass% or higher as the remainder and has a gold purity of 99.98 mass% or higher. The gold alloy wire may be one in which the amount of the calcium added is not larger than the sum of the europium and lanthanum and the amount of the yttrium added is not larger than the sum of the calcium and europium. The gold alloy wire may also be one in which the amount of the calcium added is not larger than the sum of the europium and lanthanum, the amount of the yttrium added is not larger than the sum of the calcium and europium, and the amount of the magnesium added is 20-40 mass ppm. The gold alloy wire has excellent wire strength, is excellent in the property of forming a melt ball, and gives a press-bonded ball having excellent circularity. It has excellent suitability for stitch bonding and is usable in high-density wiring.
申请公布号 WO2009060698(A1) 申请公布日期 2009.05.14
申请号 WO2008JP68677 申请日期 2008.10.15
申请人 TANAKA DENSHI KOGYO K. K.;TAKADA, MITSUO;TESHIMA, SATOSHI;KUWAHARA, TAKESHI 发明人 TAKADA, MITSUO;TESHIMA, SATOSHI;KUWAHARA, TAKESHI
分类号 H01L21/60;C22C5/02 主分类号 H01L21/60
代理机构 代理人
主权项
地址