发明名称 |
NOVEL RESIN COMPOSITION, COMPOSITE MATERIAL CONTAINING THE SAME AND USE OF THE COMPOSITE MATERIAL |
摘要 |
<p>Disclosed is a resin composition which is capable of firmly bonding a metal and a molding material. Also disclosed are a composite material containing such a resin composition and a use of such a composite material. Specifically disclosed is a resin composition containing an organic compound containing at least one secondary thiol group in a molecule, and a curable compound containing at least one hydroxy group in a molecule.</p> |
申请公布号 |
WO2009060708(A1) |
申请公布日期 |
2009.05.14 |
申请号 |
WO2008JP68887 |
申请日期 |
2008.10.17 |
申请人 |
OMRON CORPORATION;KITAMURA, KYOJI;NAKAMURA, MASAKI |
发明人 |
KITAMURA, KYOJI;NAKAMURA, MASAKI |
分类号 |
C08G59/66;B32B15/08 |
主分类号 |
C08G59/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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