| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device for stably stacking a plurality of semiconductor devices, and to provide a manufacturing method for the device. <P>SOLUTION: The present invention is a semiconductor device 100 provided with a semiconductor chip 30; a lead frame 10, that is electrically connected to the semiconductor chip 30 and provided with a recessed part 12, at least in one of the upper and lower surfaces; and a resin part 20 for encapsulating the semiconductor chip 30 and the lead frame 10 and having an opening part 22 in the upper direction of the recessed part 12. By inserting a conductive pin (not shown) into the recessed part 12 from the opening part 22, a plurality of semiconductor devices can be connected mechanically and electrically. <P>COPYRIGHT: (C)2009,JPO&INPIT |
