| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package structure for photoelectric devices which is a reliable and simple structure. <P>SOLUTION: The package structure for photoelectric devices includes a silicon substrate 11, a first insulating layer 21A or 21B, a reflective layer 22A or 22B, a second insulating layer 23A or 23B, a first conductive layer 21, a second conductive layer 22 and a die 31A. The silicon substrate has a first surface and a second surface. The first surface has a reflective opening, and the second surface has at least two electrode via holes connected to the reflective opening and a plurality of recesses disposed outside the electrode via holes. The first insulating layer overlays the first surface, the second surface and the recesses. The reflective layer is disposed on the reflective opening.; The second insulating layer is disposed on the reflective layer. The first conductive layer is disposed on the surface of the second insulating layer. The second conductive layer is disposed on the surface of the second surface and inside the electrode via holes. The die is fixed inside the reflective opening and electrically connected to the first conductive layer. <P>COPYRIGHT: (C)2009,JPO&INPIT |
