| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device with a heat sink which has superior durability to thermal stress when the semiconductor device is mounted to a printed circuit board, and superior heat radiation, and its method for manufacturing. <P>SOLUTION: The semiconductor device 10 with a heat sink comprises a first heat sink 11 formed by etching metallic foil, a plurality of terminals 12a to 12d, a semiconductor element 13 soldered to a plane of the first heat sink 11, and a sealing resin 14 for sealing the plane of the first heat sink 11, edges of a plurality of terminals 12a to 12d and the semiconductor element 13. The semiconductor device 10 also comprises bumps 16a to 16d fixed to other edges of terminals 12a to 12d, and a second heat sink 21 soldered to the other plane of the first heat sink 11. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
