发明名称 |
COMPOSITION FOR FILM FORMATION, AND INSULATING FILM CONTAINING SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a composition for film formation containing a composition serving as a material suitably used to form a coating filming film excellent in any characteristics of a low dielectric constant, humidity resistance, water resistance and heat resistance. SOLUTION: A compound containing a borazine ring and an adamantane ring is provided. The composition for film formation is also provided which contains: a compound containing the borazine ring and adamantane ring; or a compound containing the borazine ring and a compound containing the adamantane ring; or the compound containing the borazine ring and adamantane ring and the compound containing the borazine ring and/or the compound containing the adamantane ring. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009105099(A) |
申请公布日期 |
2009.05.14 |
申请号 |
JP20070273195 |
申请日期 |
2007.10.19 |
申请人 |
NIPPON SHOKUBAI CO LTD |
发明人 |
OKAJIMA MASAYUKI;YAMAMOTO TETSUYA |
分类号 |
H01L21/312;C08F230/06;C08G79/08;C09D5/25;C09D7/12;C09D201/00;H01L21/768;H01L23/522 |
主分类号 |
H01L21/312 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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