| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To stably adhere a heat spreader, consisting of metal layers, to a semiconductor chip and, further, raise heat dissipating property from the semiconductor chip. <P>SOLUTION: Insulating resin 4 with a tapered part 4a formed on the side surface thereof is filled between the semiconductor chip 5 and a tape carrier 1 and a resin layer 7 is formed so as to be adhered to the rear side of the semiconductor chip 5, onto the tape carrier 1 and the tapered part 4a, further, the metal layer 9, equipped with a recess 8 and having a configuration of being adhered to the resin layer 7, thereby the metal layer 9, functions as the heat spreader, is adhered stably to the semiconductor chip 5 and, further, heat generated from the semiconductor chip 5 is efficiently transmitted from not only the rear side of the semiconductor chip 5 but also from the side surface of the same to the metal layer 9 for the dissipation of heat thereby permitting the improvement of heat dissipating property. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
