| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing excellent especially in stress reduction, reflow resistance and thermal shock resistance without detriment to characteristics such as fluidity, flame retardancy and curability. SOLUTION: This epoxy resin composition for sealing comprises (A) an epoxy resin, (B) a curing agent and (C) a silicon-containing polymer having a specific structural moiety (1) and 8,000-12,000 number-average molecular weight. COPYRIGHT: (C)2009,JPO&INPIT
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